Electrolube HTSP01K: Silicone Heat Transfer Compound Plus provides the ultimate in thermal conductivity

Description

HTSP provides the ultimate in thermal conductivity together with the very wide temperature range obtained by using silicone base oils.HTSP Silicone Heat Transfer Compound Plus is a modified ‘Plus’ version of Electrolube’s successful HTS which provides the ultimate in thermal conductivity together with the very wide temperature range obtained by using silicone base oils. The exceptional properties obtained from HTSP are due to the novel use of various metal oxide (ceramic) powders. Directions for Use:◆ Thermal pastes can be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators, to name but a few. When the contact surfaces are placed together, a firm metal-to-metal contact will only be achieved on 40 – 60% of the interface, depending on the smoothness of the surfaces. This means that air, which has relatively poor thermal conductivity, will account for the balance of the interface. Only a small amount of compound is required to fill these spaces and thus dramatically increase the effective surface area for heat transfer.◆ It is important to note that the quality of application of a thermal paste can be as important as the thermal conductivity of the material applied; best results are achieved when a uniform, thin coat is applied between the mating surfaces. Apply a thin layer of compound to one of the contact surfaces using a brush, spatula, roller, automated system or screen printing technique. Ensure that the entire interface is covered to avoid hot-spots from forming. Any excess paste squeezed out during the mounting process should be removed.